Contact Us

Address:Wuhan Institute of Technology Incubator Building, 12th Floor
Factory: Hubei Hanchuan fenshuizhen
Contact: Mr. Cui 13733507588
Tel: 027-87053961 87053896
Fax: 027-87446231


Your current location:HomeProductsAcid copper Plating Intermediates 》text

EDTP(Q75) Acid copper Plating Intermediate

Time:2013-11-11     Klicks:2332


Chemical Name: N,N,N',N'-Tetrakis (2-hydroxypropyl) ethylenediamine Molecular formula: C14H32N2O4
Molecular weight: 292.42 CAS NO. 102-60-3


1) Quality Standards: Q/LZ 39-2008
Appearance: Colorless transparent liquid
Assay: min 75.0%
PH Value: 7.5-8.5
Density: 1.04-1.06
2) Application
Concentration in the bath: 10-30 mg/L
Usage: It is soluble in water, weakly alkaline aqueous solution. Mainly used for chemical copper complexing agent.

[Previous:NP-1 Acid copper Plating Intermediate]
[Next: 1,3-PS Acid copper Plating Intermediate]
  • QQ咨询

  • 在线咨询
  • 点击这里给我发消息
  • 点击这里给我发消息