AP-14 Acid copper Plating Intermediate

AP-14

Chemical Name: Polyether compound

1) Product Features:
Leveling, and take place excellently.
2) Quality Standards: Q/LZ 32-2008
Appearance: Colorless or yellowish powder
Assay: min 98%
PH Value: 7-8
Concentration in the bath: 0.02-1 mg/L
Solubility: well soluble in water
3) Application
Wetting agent in acid copper plating, it can improve uniform plating, especially in the low current density, usually it polyether, sulfur compounds, together with the use of ammonium, get the whole flat, shiny, and good ductility the coating. Plus there are AP-14 formula, can be used for the production of printed circuit boards and other decorative purposes, it often, and SPS, EXP2887 with use.