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SPS Acid copper Plating Intermediate
SPS
Chemical Name:Bis-(sodium sulfopropyl) -disulfide Molecular formula: C6H12Na2O6S
Molecular weight: 354.4 CAS NO. 27206-35-5
1) Product Features:
Products that not contain inorganic sulfide and sulfite, copper sulfate does not increase turbidity, scientific analysis, product quality and stability.
2) Quality Standards: Q/LZ 30-2008
Appearance: Colorless or yellowish powder
Assay: min 85% (HLPC)
Concentration in the bath: 20-100mg/L
Solubility: 38% water solution(Slightly soluble in alcohol)
3) Application
SPS for acid copper plating, decorative and functional availability coating (such as: printed circuit board). SPS can be a typical copper formulations, such as non-ionic surfactant, polyamine and other thiol compounds in combination, can also be used in conjunction with the dye, if combined with DPS and EXP2887 with, you will get better results.